
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 2011 (47 x 58) |
| Pitch - Mating: | 0.040" (1.02mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.035" (0.90mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 15.0µin (0.38µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 2174988-1 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 20POS GOLD
CONN SOCKET SIP 16POS GOLD
CONN IC DIP SOCKET 24POS GOLD
RES 267 OHM 0.5% 1/4W 0805
RES 160K OHM 0.1% 1/8W 0603
RES SMD THICK FILM 1010
CONN SOCKET LGA 2011POS GOLD