
| Type | Description |
|---|---|
| Series: | - |
| Package: | Tube |
| Part Status: | Obsolete |
| Type: | QFP |
| Number of Positions or Pins (Grid): | 100 (4 x 25) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Tin-Lead |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Phosphor Bronze |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Phosphor Bronze |
| Housing Material: | Liquid Crystal Polymer (LCP) |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 821949-4 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 8POS GOLD
CONN IC DIP SOCKET 40POS TIN
CONN IC DIP SOCKET 18POS GOLD
CAP CER MLCC
MEMS OSC XO 75.0000MHZ CMOS SMD
CONN SOCKET PQFP 100POS TIN-LEAD
XTAL OSC XO 120.8800MHZ CML SMD