
| Type | Description |
|---|---|
| Series: | Diplomate DL |
| Package: | Tray |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Thermoplastic, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 1-1825376-2 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS GOLD
CONN SOCKET PLCC 28POS TIN
CONN IC DIP SOCKET 28POS TIN
FIXED IND 3.3UH 50MA 600 MOHM
PTC RESETTABLE FUSE 40V 30A
CONN IC DIP SOCKET 28POS GOLD
INSULATED BOOT