
| Type | Description |
|---|---|
| Series: | 514 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 576 (30 x 30) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 13 |
Current price of 514-83-576M30-001148 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 20POS GOLD
CONN IC DIP SOCKET 8POS TIN
CONN IC DIP SOCKET 12POS TIN
CONN SOCKET 13POS 0.1 GOLD SMD
VOLTMETER 200VDC LED PANEL MOUNT
TERM BLOCK HDR 19POS 5.08MM
CONN SOCKET BGA 576POS GOLD