
| Type | Description |
|---|---|
| Series: | 8 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 |
Current price of 20-8650-310C is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 25POS GOLD
CONN SOCKET SIP 9POS GOLD
CONN SOCKET SIP 16POS GOLD
RES THICK FILM AXIAL
.050" (1.27MM) MICRO HEADER
CONN IC DIP SOCKET 20POS GOLD
DTS24G15-05SB-6149