
| Type | Description |
|---|---|
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 425 |
Current price of 528-AG12D-LF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 12POS GOLD
CONN HDR SOLDRTL
CONN IC DIP SOCKET ZIF 24POS TIN
CONN IC DIP SOCKET 28POS TIN
CONN HEADER R/A 12POS 4.2MM
CONN RCPT MALE 55POS GOLD SOLDER
38999 8C 8#16 PIN RECP