
| Type | Description |
|---|---|
| Series: | 8 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 30 (2 x 15) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 7 |
Current price of 30-81250-610C is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
PGA SOLDER TAIL 1.27MM
CONN IC DIP SOCKET 16POS GOLD
SKT PGA SOLDRTL
CONN IC DIP SOCKET 30POS GOLD
CONN HEADER SMD 36POS 2MM
CONN SOCKET 129P 0.079 GOLD PCB
CONN SOCKET 5POS 0.1 GOLD PCB