
| Type | Description |
|---|---|
| Series: | 57 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 11 |
Current price of 28-3574-16 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SKT IC CLOSED
SKT PGA WRAPOST
CONN IC DIP SOCKET 10POS GOLD
XTAL OSC XO 3.3V 6SMD
CONN IC DIP SOCKET ZIF 28POS GLD
CONN SOCKET SIP 1POS GOLD
CONN RCPT 3POS 0.156 TIN SMD