
| Type | Description |
|---|---|
| Series: | 6556 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 48 (2 x 24) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 9 |
Current price of 48-6556-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SKT PGA SOLDRTL
CONN IC DIP SOCKET 6POS GOLD
CONN SOCKET SIP 64POS GOLD
CONN IC DIP SOCKET 48POS GOLD
CONN PLUG MALE 3P SILV SLDR CUP
CONN RCPT MALE 22P SILV SLDR CUP
EVAL BOARD W/LOAD TESTER ISL6