
| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Nickel |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Nickel |
| Housing Material: | Polyetheretherketone (PEEK), Glass Filled |
| Operating Temperature: | -55°C ~ 250°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 |
Current price of 24-6551-18 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SKT CARRIER PGA
CONN IC DIP SOCKET 40POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN RCPT 88POS 0.05 GOLD SMD
SFERNICE FIXED RESISTORS
CONN IC DIP SOCKET ZIF 24POS
CONN RCPT 16POS 0.1 GOLD SMD