| Type | Description |
|---|---|
| Series: | 8 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 10 (2 x 5) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 15 |
Current price of 10-8796-210C is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 23POS GOLD
SKT PGA SOLDRTL
CONN IC DIP SOCKET 50POS GOLD
CONN IC DIP SOCKET 10POS GOLD
CONTACT SOCKET SZ 12 CRIMP GOLD
CONN BOTTOM 13POS 1MM SMD R/A
CONN HDR 14POS 0.1 STACK T/H
