
| Type | Description |
|---|---|
| Series: | 503 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.9" (22.86mm) Row Spacing |
| Number of Positions or Pins (Grid): | 30 (2 x 15) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Phosphor Bronze |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 5 |
Current price of 30-9503-21 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET ZIF 48POS TIN
CONN IC DIP SOCKET 6POS GOLD
CONN SOCKET SIP 7POS GOLD
RES SMD 2K OHM 5% 1/4W 1206
MEMS OSC XO 156.2500MHZ HCSL SMD
CONN IC DIP SOCKET 30POS GOLD
D38999/21HD97SC