
| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 36 (2 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 14 |
Current price of 36-3552-10 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET PGA 456POS GOLD
CONN IC SKT DBL
SKT PGA SOLDRTL
HEATSINK 25X25X25MM R-TAB T412
XTAL OSC XO 22.5792MHZ CMOS SMD
CONN RCPT HSG 14POS 2.00MM
CONN IC DIP SOCKET ZIF 36POS TIN