
| Type | Description |
|---|---|
| Series: | 558 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 388 (26 x 26) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 15 |
Current price of 558-10-388M26-001101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SOCKET 34 CONTACTS SINGLE ROW
CONN SOCKET SIP 20POS GOLD
CONN IC DIP SOCKET ZIF 36POS TIN
CAP FILM 3300PF 5% 1KVDC RADIAL
PGA SOLDER TAIL 1.27MM
DC DC CONVERTER 5V 75W
DC DC CONVERTER 18.5V 100W