
| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 30 (2 x 15) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 17 |
Current price of 30-1518-11H is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SKT PGA SOLDRTL
CONN IC SKT DBL
CONN SOCKET SIP 20POS GOLD
XTAL OSC VCXO 184.3200MHZ HCSL
CONN IC DIP SOCKET 30POS GOLD
XTAL OSC VCTCXO 50.0000MHZ LVCMO
MEMS OSC AUTO LOW JITTER -40C-85