
| Type | Description |
|---|---|
| Series: | 614 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 321 (21 x 21) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 2310 |
Current price of 614-87-304-41-001101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SKT PGA SOLDRTL
CONN SOCKET PGA 411POS GOLD
CONN IC SKT DBL
MEMS OSC XO 32.7680MHZ LVCMOS LV
PCB TERM 5MMPS 15PVERT15A300VGRN
CONN IC DIP SOCKET 321POS GOLD
JAM NUT RECP ASSY