
| Type | Description |
|---|---|
| Series: | 8 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 18 |
Current price of 08-81250-210C is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 20POS TIN
CONN IC SKT DBL
SKT PGA SOLDRTL
CONN IC DIP SOCKET 8POS GOLD
CONN RCPT 100POS 0.05 GOLD PCB
CONN RCPT FMALE 20P SOLDER CUP
CORE IRON