
| Type | Description |
|---|---|
| Series: | 523 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 68 (11 x 11) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of 523-93-068-11-061001 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SKT PGA SOLDRTL
CONN IC DIP SOCKET 50POS GOLD
CONN SOCKET PGA TIN
CONN EDGE DUAL FMALE 10POS 0.100
CONN HDR 6POS 0.1 STACK SMD TIN
PGA SOCK 68PIN 11X11 WIRE WRAP
TERM BLK 18P SIDE ENT 3.5MM PCB