
| Type | Description |
|---|---|
| Series: | 8 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 10 (2 x 5) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 15 |
Current price of 10-8850-210C is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC SKT DBL
SKT PGA SOLDRTL
SKT PGA SOLDRTL
CONN HEADER VERT 100POS 2.54MM
CONN RCPT 185POS 0.079 GOLD PCB
CONN IC DIP SOCKET 10POS GOLD
2MM TERMINAL STRIP