
| Type | Description |
|---|---|
| Series: | 558 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 256 (20 x 20) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Brass |
| Mounting Type: | Surface Mount |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 19 |
Current price of 558-10-256M20-001104 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 31POS GOLD
CONN IC SKT DBL
CONN IC DIP SOCKET 18POS GOLD
CONN BRD STACK 2.00 22POS
BGA SURFACE MOUNT 1.27MM
CONN HDR 8POS 0.1 STACK SMD GOLD
CONN HDR 34POS 0.1 STACK SMD