
| Type | Description |
|---|---|
| Series: | 550 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 520 (31 x 31) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 12 |
Current price of 550-10-520M31-001166 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC SKT DBL
SKT PGA SOLDRTL
CONN IC DIP SOCKET 24POS GOLD
BGA PIN ADAPTER 1.27MM SMD
2MM TERMINAL STRIP
CONN RCPT 18POS 0.079 GOLD SMD
10X14 WRN HIGH VOLTAGE