
| Type | Description |
|---|---|
| Series: | 614 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 281 (19 x 19) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 22 |
Current price of 614-83-281-19-001112 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 52POS GOLD
CONN IC SKT DBL
CONN IC SKT DBL
CONN BRD STACK 2.00 20POS
CONN SOCKET PGA 281POS GOLD
CONN EDGE DUAL FMALE 12POS 0.039
CONN HDR 10POS 0.05 STACK SMD