
| Type | Description |
|---|---|
| Series: | 508 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 1 (1 x 1) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Wire Wrap |
| Pitch - Post: | - |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6 |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 143 |
Current price of 01-0508-31 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN HDR SOLDRTL
CONN IC SKT DBL
CONN IC SKT DBL
RES SMD 39.2K OHM 1% 3/4W 2010
RES SMD 4.81K OHM 0.1% 1/5W 0805
CAP CER SMP MLC HI-REL
CONN SOCKET SIP 1POS GOLD