
| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 22 (2 x 11) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 54 |
Current price of 116-93-422-41-007000 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
BGA SURFACE MOUNT 1.27MM
SOCKET CARRIER LOWPRO .400 22POS
SKT PGA SOLDRTL
MEMS OSC XO 166.66666MHZ LVCMOS
DC DC CONVERTER 28V 150W
CONN IC DIP SOCKET 22POS GOLD
DC DC CONVERTER 13.8V 100W