
| Type | Description |
|---|---|
| Series: | 550 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 356 (26 x 26) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Brass |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 14 |
Current price of 550-10-356M26-001152 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC SKT DBL
CONN IC SKT DBL
IC SOCK COLLET CT 20 PIN GOLD
CONN HEADER SMD 65POS 1MM
BGA SOLDER TAIL
CONN HEADER VERT 22POS 2.54MM
CONN HDR 13POS 0.1 STACK SMD