
| Type | Description |
|---|---|
| Series: | 115 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.9" (22.86mm) Row Spacing |
| Number of Positions or Pins (Grid): | 52 (2 x 26) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 350 |
Current price of 115-87-952-41-001101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC SKT DBL
SKT CARRIER PGA
CONN IC DIP SOCKET 60POS GOLD
SFERNICE THIN FILMS
STANDRD SOLDER TAIL SIP SOCKET
CONN IC DIP SOCKET 52POS GOLD
CONN HDR 6POS 0.05 STACK T/H