
| Type | Description |
|---|---|
| Series: | 503 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.9" (22.86mm) Row Spacing |
| Number of Positions or Pins (Grid): | 50 (2 x 25) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Phosphor Bronze |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 6 |
Current price of 50-9503-20 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SKT PGA SOLDRTL
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 32POS GOLD
ANVIL, COMBINATION
CONN EDGE DUAL FMALE 60POS 0.125
CONN IC DIP SOCKET 50POS GOLD
CONN HEADER R/A 50POS 2MM