
| Type | Description |
|---|---|
| Series: | 550 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 241 (18 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 22 |
Current price of 550-10-241-18-071101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 24POS GOLD
SKT PGA WRAPOST
CONN SOCKET SIP 64POS GOLD
CONN HDR 28POS 0.1 STACK SMD
PGA SOLDER TAIL
CONN HDR 24POS 0.05 STACK SMD
CONN HDR 26POS 0.1 STACK SMD