
| Type | Description |
|---|---|
| Series: | 700 |
| Package: | - |
| Part Status: | Obsolete |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Aluminum Alloy |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 1-1437542-1 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET PGA ZIF 321POS GOLD
CONN IC DIP SOCKET 32POS TIN
CONN IC DIP SOCKET 28POS TIN
CONN HEADER VERT 14POS 2.54MM
CONN RCPT 12POS 0.079 GOLD SMD
CONN RCPT HSG MALE 32POS PNL MT
CONN IC DIP SOCKET 8POS GOLD