SIP1X27-014BLF

Part No :: SIP1X27-014BLF

Manufacturer: Storage & Server IO (Amphenol ICC)

VIGOR # :: 9332884

Description: CONN SOCKET SIP 27POS TIN

Catalog: Sockets for ICs, Transistors

DataSheet: SIP1X27-014BLF PDF

Country of origin: -

Date code: -

SIP1X27-014BLF Specifications

Type	Description
Series:	SIP1x
Package:	Bulk
Part Status:	Obsolete
Type:	SIP
Number of Positions or Pins (Grid):	27 (1 x 27)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Tin
Contact Finish Thickness - Mating:	150.0µin (3.81µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:	-

Please confirm the specifications of the products when ordering.
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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
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In Stock: 0

Shipped from

HK warehouse

Expected Shipping Date

Oct 09 - Oct 13 2026

Pricing(USD)

Quantity	Unit Price	Ext. Price

Current price of SIP1X27-014BLF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com

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