| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Axial |
| Number of Positions or Pins (Grid): | 2 (Rectangular) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Board Guide |
| Termination: | Solder |
| Pitch - Post: | 0.150" (3.81mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS) |
| Operating Temperature: | -65°C ~ 150°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of TDU02DXTB is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 36POS TIN
CONN IC SKT DBL
TEST SOCKET
CONN RCPT FMALE 5P SILVER CRIMP
