SIP1X30-041BLF

Part No :: SIP1X30-041BLF

Manufacturer: Storage & Server IO (Amphenol ICC)

VIGOR # :: 9333460

Description: CONN SOCKET SIP 30POS GOLD

Catalog: Sockets for ICs, Transistors

DataSheet: SIP1X30-041BLF PDF

Country of origin: -

Date code: -

SIP1X30-041BLF Specifications

Type	Description
Series:	SIP1x
Package:	Bulk
Part Status:	Obsolete
Type:	SIP
Number of Positions or Pins (Grid):	30 (1 x 30)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:	-

Please confirm the specifications of the products when ordering.
MOQ means the minimum order quantity required to purchase each parts.
If you have special order instructions,please note it on the ordering pages.
The Pre-Shipment Inspection (PSI) will be applied.
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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
Tracking number will be sent once your order has been shipped. (It may take up to 24 hours before carriers display the info.)

In Stock: 0

Shipped from

HK warehouse

Expected Shipping Date

Dec 31 - Jan 04 2025

Pricing(USD)

Quantity	Unit Price	Ext. Price

Current price of SIP1X30-041BLF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com

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