
| Type | Description |
|---|---|
| Series: | SIP1x |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 15 (1 x 15) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of SIP1X15-011BLF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 23POS GOLD
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 6POS GOLD
HI CM VLTG GAIN PROG DIFF AMP
IC CROSSPOINT SWITCH DUAL 28SSOP
FIXED IND 1.5UH 310MA 490 MOHM
CONN SOCKET SIP 15POS GOLD