
| Type | Description |
|---|---|
| Series: | 700 |
| Package: | - |
| Part Status: | Obsolete |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Aluminum Alloy |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 5-1437542-8 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 48POS TIN
CONN IC DIP SOCKET 6POS GOLD
CONN SKT 1.27MM OTBGA TYPE II
ERL-05 357 1% T-1 RLR05C3570FR R
RES 4.42K OHM 1/10W .1% AXIAL
ASTMUPCV-33-155.520MHZ-LJ-E-T3
MEMS OSC XO 155.5200MHZ LVCMOS
CONN IC DIP SOCKET 32POS GOLD