
| Type | Description |
|---|---|
| Series: | OEM |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | QFP |
| Number of Positions or Pins (Grid): | 100 (4 x 25) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Tin-Lead |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyethersulfone (PES), Glass Filled |
| Operating Temperature: | 0°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 2100-7243-00-1807 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET SIP 24POS TIN
CONN IC DIP SOCKET 24POS TIN
CONN IC DIP SOCKET 22POS TIN
CAP CER MLCC
CE-225-1004
CONN TERM BLK GROUND 1/0-6AWG
CONN SOCKET PQFP 100POS TIN-LEAD