
| Type | Description |
|---|---|
| Series: | 100 |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 8.00µin (0.203µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Seal Tape |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | Flash |
| Contact Material - Post: | Brass |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | -65°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 100-040-001 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
808-11P1= INSUL.(RYNITE,BLK.)W
CONN IC DIP SOCKET 34POS TIN
CONN IC DIP SOCKET 20POS GOLD
RES SMD 2.2 OHM 1% 1/2W 1210
CAP CER 430PF 25V C0G/NP0 RADIAL
TB DIN 3DECK 24A 300V 12AWG 20PC
CONN IC DIP SOCKET 40POS GOLD