
| Type | Description |
|---|---|
| Series: | 800 |
| Package: | Tube |
| Part Status: | Obsolete |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin-Lead |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Polyester |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 808-AG12D is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET PQFP 100POS TIN-LEAD
CONN SOCKET LGA 1356LGA GOLD
CONN IC DIP SOCKET 16POS GOLD
RES SMD 3.74KOHM 0.1% 1/16W 0402
ERL-05-19 287K 1% T-1 RLR05C2873
MEMS OSC LVCMOS 25PPM 3.2X2.5MM
CONN IC DIP SOCKET 8POS TIN-LEAD