
| Type | Description |
|---|---|
| Series: | Diplomate DL |
| Package: | Box |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 18 (2 x 9) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Thermoplastic, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 2-382713-6 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN SOCKET PGA ZIF GOLD
CONN IC DIP SOCKET 14POS TIN
CONN SOCKET PLCC 84POS TIN
CAP CER 1210 8.2NF 10V ULTRA STA
CAP CER 5.6PF 50V U2J 0603
FIXED IND 180NH 80MA 6.5 OHM SMD
CONN IC DIP SOCKET 18POS TIN