SIP050-1X18-157BLF

Part No :: SIP050-1X18-157BLF

Manufacturer: Storage & Server IO (Amphenol ICC)

VIGOR # :: 9333776

Description: CONN SOCKET SIP 18POS TIN

Catalog: Sockets for ICs, Transistors

DataSheet: SIP050-1X18-157BLF PDF

Country of origin: -

Date code: -

SIP050-1X18-157BLF Specifications

Type	Description
Series:	SIP050-1x
Package:	Bulk
Part Status:	Obsolete
Type:	SIP
Number of Positions or Pins (Grid):	18 (1 x 18)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Tin
Contact Finish Thickness - Mating:	200.0µin (5.08µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:	-

Please confirm the specifications of the products when ordering.
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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
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In Stock: 0

Shipped from

HK warehouse

Expected Shipping Date

May 04 - May 08 2026

Pricing(USD)

Quantity	Unit Price	Ext. Price

Current price of SIP050-1X18-157BLF is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com

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