
| Type | Description |
|---|---|
| Series: | BDN |
| Package: | Box |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.810" (45.97mm) |
| Width: | 1.810" (45.97mm) |
| Diameter: | - |
| Fin Height: | 0.605" (15.37mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 2.80°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | 8.10°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 | ||
| 1000 |
Current price of BDN18-6CB/A01 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
HEATSINK 45X45X15MM XCUT
HEATSINK 45.00MM X 45.00MM ALUM
HEATSINK 35X35X25MM L-TAB T766
CAP FILM 0.022UF 5% 63VDC RADIAL
MEMS OSC XO 31.2500MHZ H/LV-CMOS
HEATSINK CPU W/ADHESIVE 1.81"SQ
CONN DIN RCPT 48POS PNL MNT GOLD