
| Type | Description |
|---|---|
| Series: | BDN |
| Package: | Box |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.810" (45.97mm) |
| Width: | 1.810" (45.97mm) |
| Diameter: | - |
| Fin Height: | 0.355" (9.02mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 3.50°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | 10.80°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Quantity | Unit Price | Ext. Price |
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Current price of BDN18-3CB/A01 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
HEATSINK 36.83X57.6X22.86MM
HEATSINK 30X30X35MM R-TAB T766
HEATSINK 60X60X12.7MM XCUT T766
RES 300 OHM 13W 10% AXIAL
XTAL OSC VCXO 184.3200MHZ HCSL
HEATSINK CPU W/ADHESIVE 1.81"SQ
BACKSHELL STRAIGHT PRE-SHIELD AD