
| Type | Description |
|---|---|
| Series: | 658 |
| Package: | - |
| Part Status: | Obsolete |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.100" (27.94mm) |
| Width: | 1.100" (27.94mm) |
| Diameter: | - |
| Fin Height: | 0.598" (15.20mm) |
| Power Dissipation @ Temperature Rise: | 2.5W @ 30°C |
| Thermal Resistance @ Forced Air Flow: | 2.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of 658-60ABT2 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
HEATSINK EXTRUD 12.7X34.9X38.1MM
HEATSINK STAMP 10X21.2X19MM
HEATSINK STAMP 36.8X44.5X9.4MM
MEMS OSC XO 125.0000MHZ LVPECL
XTAL OSC VCXO 625.0000MHZ LVDS
TERM BLOCK HDR 5POS VERT 5.08MM
HEATSINK CPU 28MM SQ BLK W/TAPE