
| Type | Description |
|---|---|
| Series: | APF |
| Package: | Box |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.748" (19.00mm) |
| Diameter: | - |
| Fin Height: | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of APF19-19-13CB is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
HEATSINK TO-220/202 VERT W/TABS
HEATSINK TO-3 BLACK
HEATSINK TO-220 BLACK
XTAL OSC VCXO 25.0000MHZ LVDS
RES 1.5M OHM 1% 1/16W 0402
CAP ARRAY 10000PF 25V X7R 0805
HEATSINK LOW-PROFILE FORGED