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Type | Description |
---|---|
Series: | - |
Package: | Bag |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip |
Shape: | Cylindrical |
Length: | - |
Width: | - |
Diameter: | 1.375" (34.92mm) OD |
Fin Height: | 0.442" (11.23mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 5.99°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 13.20°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
RES SMD 2.2K OHM 5% 1W 2512
RES 316 OHM 1% 1W 1812
RES 80.6K OHM 1/4W .1% AXIAL
25MM HEATSINK ASSEMBLY