HF115AC-0.0055-AC-105

Part No :: HF115AC-0.0055-AC-105

Manufacturer: Henkel / Bergquist

VIGOR # :: 2739860

Description: THERM PAD 36.83MMX21.29MM W/ADH

Catalog: Thermal - Pads, Sheets

DataSheet: HF115AC-0.0055-AC-105 PDF

Country of origin: -

Date code: -

HF115AC-0.0055-AC-105 Specifications

Type	Description
Series:	Hi-Flow® 115-AC
Package:	Bulk
Part Status:	Active
Usage:	SIP
Type:	Pad, Sheet
Shape:	Rectangular
Outline:	36.83mm x 21.29mm
Thickness:	0.0055" (0.140mm)
Material:	Phase Change Compound
Adhesive:	Adhesive - One Side
Backing, Carrier:	Fiberglass
Color:	Gray
Thermal Resistivity:	0.35°C/W
Thermal Conductivity:	0.8W/m-K

Please confirm the specifications of the products when ordering.
MOQ means the minimum order quantity required to purchase each parts.
If you have special order instructions,please note it on the ordering pages.
The Pre-Shipment Inspection (PSI) will be applied.
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Delivery time: At the same day (Order deadline is 2pm, HK Time).
Delivery date: usually 2 to 7 working days.
It is unable to appoint a date of delivery.
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In Stock: 0

Shipped from

HK warehouse

Expected Shipping Date

Feb 11 - Feb 15 2026

Pricing(USD)

Quantity	Unit Price	Ext. Price
1	~~$0.05~~	~~$0.05~~
14300	~~$0.05~~	~~$750.75~~

Current price of HF115AC-0.0055-AC-105 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com

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HF115AC-0.0055-AC-105

HF115AC-0.0055-AC-105

2739860

Pricing(USD)