
| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 1.76 oz (50g) |
| Shelf Life: | 12 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 68°F ~ 77°F (20°C ~ 25°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of TS391SNL50 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
LEADED NO CLEAN SOLDER PASTE
SOLDER FLUX-CORED/44 .024" 1LB S
SOLDER FLUX-CORED/245 .025 500G
XTAL OSC VCXO 148.351648MHZ HCSL
THERMALLY STABLE SOLDER PASTE NO
SNK PRE-PRINTED
SENSOR LINEAR CBL W/CONN