
| Type | Description |
|---|---|
| Series: | - |
| Package: | Jar |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 8.8 oz (250g) |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 |
Current price of SMD291SNL250T5 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SOLDER FLUX-CORED/48 .093 1LB SP
LF SOLDER WIRE MINI POCKET PACK
96SC C400 3C 0.56MM 0.25KG.022"
FIXED IND 10UH 520MA 559 MOHM
TVS DIODE 94V 152V 1.5KE
SOLDER PASTE SAC305 250G T5
TIMER,FLOW,T1,485