
| Type | Description |
|---|---|
| Series: | NXG1 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter: | - |
| Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 17.64 oz (500g) |
| Shelf Life: | 8 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 |
Current price of 70-3213-0810 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
SN96.5AG3.0CU0.5 3.3%/268 .010
LEAD FREE NO-CLEAN FLUX CORE SIL
SOLDER FLUX-CORED/331 63/37 .020
SOLDER PASTE NXG1 NO CLEAN 500GM
THERMISTOR PROBE, #8 RING LUG, 1
2.4 GHZ 63MW WIRELESS BRIDGE WIT
S4WM-1564409036-0B800G3S-00001
LED WHITE SAW91564A 19X19