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Type | Description |
---|---|
Series: | 4860 |
Package: | Bulk |
Part Status: | Obsolete |
Type: | Solder Paste |
Composition: | Sn63Pb37 (63/37) |
Diameter: | - |
Melting Point: | 361°F (183°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Leaded |
Form: | Jar, 8.8 oz (250g) |
Shelf Life: | 24 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 35°F ~ 50°F (2°C ~ 10°C) |
RES 942K OHM 0.25% 1/4W 1210
CAP CER 5.6PF 50V NP0 0402
LEADED NO CLEAN SOLDER PASTE
RES 145K OHM 0.25% 1/8W 1206