1SX165HU3F50E2VG vs 1SX165HU2F50I2VG

This detailed comparison of 1SX165HU3F50E2VG and 1SX165HU2F50I2VG in the Embedded - System On Chip (SoC) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

1SX165HU3F50E2VG

Intel

1SX165HU2F50I2VG

Intel

Specifications Hide identical items

Manufacturer	Intel	Intel
Package / Case	2397-BBGA, FCBGA	2397-BBGA, FCBGA
Description	IC FPGA STRATIX 10 2397FBGA	IC FPGA STRATIX 10 2397FBGA
In Stock	0	0
Mounting Type	-	-
Part Status	Active	Active
Series	Stratix® 10 SX	Stratix® 10 SX
Package	Tray	Tray
Architecture	MCU, FPGA	MCU, FPGA
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size	-	-
RAM Size	256KB	256KB
Peripherals	DMA, WDT	DMA, WDT
Connectivity	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	1.5GHz	1.5GHz
Primary Attributes	FPGA - 1650K Logic Elements	FPGA - 1650K Logic Elements
Operating Temperature	0°C ~ 100°C (TJ)	-40°C ~ 100°C (TJ)
Supplier Device Package	2397-FBGA (50x50)	2397-FBGA (50x50)

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